PT. Artha Intilestari
Head Office:
Jl. Prof, Dr. Latumenten no. 10. Jakarta Barat DKI Jakarta 11460. Indonesia.
Branch Offices:
Bandung
Jl. PHH Mustofa No. 35. Gedung Dapensos Lt. 4, Bandung 40124. Indonesia
Phone: 0812 24448089
Surabaya
Jl. Dukuh Kupang Timur X / 69C, Surabaya 60225, Indonesia
Phone: (031) 5681309
Yogyakarta
Ruko Bayeman Permai A-15, Jl. Wates Km 3.5, Yogyakarta 556182, Indonesia
Phone: (0274) 560753
Jl. Prof, Dr. Latumenten no. 10. Jakarta Barat DKI Jakarta 11460. Indonesia.
Branch Offices:
Bandung
Jl. PHH Mustofa No. 35. Gedung Dapensos Lt. 4, Bandung 40124. Indonesia
Phone: 0812 24448089
Surabaya
Jl. Dukuh Kupang Timur X / 69C, Surabaya 60225, Indonesia
Phone: (031) 5681309
Yogyakarta
Ruko Bayeman Permai A-15, Jl. Wates Km 3.5, Yogyakarta 556182, Indonesia
Phone: (0274) 560753
021 5631149-50
021 56975420
021 56975420
089654260311
021 5631151
Laser Machine
ULTRA X6000The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
ILS9.75The ILS9.75 is a free-standing platform with a materials processing envelope of 36” x 24” x 12” or 10,368 in³ (914 x 610 x 305 mm or 169,901 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).
VLS2.30DTThe VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source.
PLS4.75The PLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 9" or 3,888 in³ (610 x 457 x 229 mm or 63,713 cm³). The single laser platform supports either one 10.6µm CO2 laser (10 to 75 watts) or one 9.3µm CO2 laser (30, 50, or 75 watts).